The reasons for tin bead formation during the production of solder wire in welding are as follows: The causes of tin bead formation during the use of solder wire are largely due to factors such as low temperature, excessive welding time, and moisture in the product itself. To avoid this issue, manufacturers should correctly select the diameter of the solder wire according to the product, and properly control the temperature of the soldering iron tip and the welding time. When welding, appropriate welding tools and welding sequence times should be chosen. These methods can effectively minimize the formation of tin beads.
1: Temperature reason: When welding products, if the temperature does not reach the welding temperature, the solder wire cannot melt, potentially leading to tin bead formation.
2: Long welding time, excessive melted solder wire, easily forms small tin beads.
3: Improper storage of welding products causing moisture, which can produce tin beads when exposed to high temperatures. To avoid tin bead formation during welding, consider the following methods:
1: Correctly select the appropriate solder wire for the product; solder wire with a smaller diameter can melt quickly and reduce tin bead formation.
2: Control the welding temperature and time; properly controlling the temperature and welding time during the welding process can reduce tin bead formation.
3: To prevent large tin beads from forming during the welding process, manufacturers can choose solder wire with a smaller diameter for the product and control the welding temperature and time. Additionally, try to remove the tin beads as much as possible.
4: For better subsequent use of the product, it is recommended to clean up any residues generated after welding, to avoid affecting the next welding effect.
5: Electronic products and welding products should be stored in a dry, well-ventilated warehouse to avoid moisture, which can affect tin bead formation during welding.
焊锡丝在生产焊接中产生锡珠原因如下：
焊锡丝在使用过程中产生锡珠的原因大至与温度过低、焊接时间过长、产品本身受潮等因素引起。为了避免这一问题的出
现，厂家应根据产品正确的选择焊锡丝直径大小，正确控制好烙铁头的温度与焊接时间。在焊接时应选合适的焊接工具与
焊接顺序时间。通过这些方法尽可能有效的避免锡珠产生。
1：焊接温度原因：当焊接产品时温度达不到焊接温度，焊锡丝不能熔化，有可能会产生锡珠。
2：焊接接时间长，熔化的焊锡丝过多，容易形成小锡珠。
3：焊接产品存放不当产品受潮，经过高温会产生锡珠。
为避免焊接时产生锡珠可以参考下办法：
1：正确选择合适产品的焊锡丝，直径较小的焊锡丝容易达到快速熔化，并减少锡珠产生。
2：控制好焊接温度与时间，在焊接过程中正确控制温度与焊接时间，这样可以减少锡珠产生。
3：防止焊接过程中出现大的锡珠产生，厂家可以根据产品选择合适直径较小的焊锡丝，并控制好焊接的温度和时间。同时
尽可能地将锡珠去掉。
4：为产品后期使用效果更好，建议有条件清理下焊接后产生的残留物，以免影响下一次的焊接效果。
5：电子产品与焊接产品存放应在干燥通风仓库存放，避免产品受潮，影响焊接时炸锡产生锡珠。
